In addition to a slew of laptop CPUs and GPUs, Dr. AMD CEO Lisa Su also made several announcements about desktop and data center products during her opening keynote of CES 2023 in Las Vegas. The top-end Ryzen 7000 X3D Series CPUs with integrated 3D Vcache are billed as the world’s most powerful CPUs for gaming, replacing the recently launched Ryzen 9 7950X at the top of AMD’s stack. There are also new mainstream desktop CPUs with limited overclocking support, which AMD promises will reach attractive price points. The new Instinct MI300 is what AMD calls the world’s first integrated data center chip, combining CPU and GPU cores plus more, while the new Alveo A70 plug-in accelerator card leverages the company’s new XDNA AI acceleration architecture.
Following on from the only model in the previous generation with integrated 3D Vcache, the Ryzen 7 5800X3D touted by AMD as the world’s fastest processor for gaming, there are now three choices. The new flagship Ryzen 9 7950X3D has 16 cores and 32 threads, with a huge total cache memory of 144MB. It has a TDP rating of 120 W and a boost speed of 5.7 GHz. It will be aimed at those who play games and also run heavy content creation workloads. It is claimed to deliver up to 24 percent better performance in games compared to the previous generation.
There’s also the Ryzen 9 7900X3D with 12 cores and 140 MB of cache, and the Ryzen 7 7800X3D with eight cores and 104 MB of total cache. The Ryzen 7000 X3D CPU family will be available in February 2023 and pricing will be announced then.
Additionally, there are three new mainstream Ryzen 7000 CPUs targeting the 65W TDP level. Retail CPUs come with a cooler in the box. The 12-core Ryzen 9 7900 costs $429, the 8-core Ryzen 7 7700 costs $329, and the Ryzen 5 7600 costs $229. All three go on sale January 10.
Su also announced that purchasers of select Ryzen 7000 CPUs will receive a free copy of Star Wars Jedi: Survivor when it becomes available.
The Instinct MI300 is said to be the world’s first integrated data center chip with CPU, GPU and memory combined in one package. It features 24 CPU cores based on the Zen 4 architecture, CDNA3 compute accelerator architecture and 128 GB of HBM3 memory. This chip is built using advanced 3D stacking technology with nine 5nm chiplets on top of four 6nm chiplets. In total, it contains more than 146 billion transistors and is the most complex chip AMD has ever designed. The company claims 8x better performance and 5x higher efficiency than the previous generation Instinct MI250X HPC accelerator. It should make it possible to process much larger AI models faster, at a lower cost and with significantly lower power consumption. It will be sampled soon for HPC and AI customers and will hit the market in 2H 2023.
The AMD Alveo A70 is a low-profile add-in card based on the new XDNA AI architecture that AMD says will scale across products and address multiple segments. The Alveo A70 is optimized for AI inference and power efficiency, and is said to be capable of 80 percent higher performance than the competition from Nvidia, in AMD’s own tests. It is now available for pre-order AI cloud infrastructure developers.